| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS61087DRCR | 电源IC |
TI/德州仪器 |
QFN |
11+ |
2500 |
|||
| MT6797W/CT |
|
逻辑IC |
MTK/联发科 |
BGA |
18+ |
500 |
||
| TPS65167ARHAR | 电源IC |
TI/德州仪器 |
QFN |
11+ |
2300 |
|||
| MSM-8994-8-1044MNSP-TR-01-0 | 逻辑IC |
QUALCOMM/高通 |
BGA |
16+ |
15000 |
|||
| MSM8274-0-990BPNSP-TR-01-0-AC | QUALCOMM/高通 |
BGA |
1511+ |
17000 |
||||
| KMZZ60020M-A218 | IC |
SAMSUNG/三星 |
BGA |
24+ |
91 |
|||
| MAX14803AEWZ | MAXIM/美信 |
BGA |
1027+ |
466 |
||||
| MT62F1536M64D8CL-026 WT ES:B | 电源IC |
MICRON/美光 |
BGA |
21 |
1500 |
|||
| T6ND5AMBG | TOSHIBA/东芝 |
QFN |
1251+ |
48 |
||||
| DRV10964HF | 电源IC |
TI/德州仪器 |
QFN |
19+ |
2500 |
|||
| SMB358SET | 其他被动元件 |
QUALCOMM/高通 |
BGA |
5000 |
||||
| KMSJS000KM-B308 | 内存芯片 |
SAMSUNG/三星 |
BGA |
5000 |
||||
| SDIN8DE4-16G | 内存芯片 |
SANDISK |
BGA |
5000 |
||||
| MAX77826 | 内存芯片 |
MAXIM/美信 |
BGA |
5000 |
||||
| C1N75R | TI/德州仪器 |
BGA |
5000 |
|||||
| ACPM-7617 | 其他被动元件 |
AVAGO/安华高 |
QFN |
5000 |
||||
| S1029 | ST/意法 |
BGA |
5000 |
|||||
| SHTC1 | 温度传感器 |
ST/意法 |
BGA |
5000 |
||||
| VC0578BRDB | 其他被动元件 |
TOSHIBA/东芝 |
QFN |
0526+ |
100 |
|||
| TPS61311YFFR | 其他被动元件 |
TI/德州仪器 |
DSBGA-20 |
14+ |
1500 |
商家默认展示20条库存